Artykuły techniczne

Artykuły techniczne

Resins for potting and encapsulation in the electronics and electrical industries

Dodatki: Encapsulation Resins

Resins used for these applications can be of various chemical types. Epoxy resins have been widely used for many years – they are generally hard and tough and exhibit low shrinkage on cure. They are characterised by an excellent level of mechanical properties, good high temperature performance and good adhesion to a wide variety of substrates – chemical resistance is also good. The cross-linking or curing process generally takes place slowly especially where small volumes of resin are involved. Fast cure hardeners can be used but these generate…

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